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John Knights
Senior Director of Business Development

 

PARC publications

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printed and flexible electronics

Novel packaging with rematable spring interconnect chips for MCM

ECTC 2009

26 May 2009

Mass produced printed temperature sensors

FlexTech Alliance 2012 Flexible Electronics and Displays Conference

8 February 2012

 

 

 

contact

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in the news   view all 

Global Flexible Electronics Market to Reach US$25.9 Billion by 2018, According to New Report by Global Industry Analysts, Inc.
19 July 2012 | Digital Journal

PARC helps drive innovation in PE
8 April 2010 | Printed Electronics Now

What printed-electronics leaders are working on now
3 December 2009 | Converting Magazine Blog


 

events   view all 

Mass Produced Printed Temperature Sensors
8 February 2012 | Phoenix, AZ