Chip on glass bonding using StressedMetal™ Technology

2005 SID International Symposium Digest of Technical Papers

24 May 2005

Wafer level packaging using StressedMetal™ technology

IMAPS 2004

14 November 2004

Stressed-metal NiZr probes for atomic force microscopy

Microelectronic Engineering

June 2003

Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology

12th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers '03)

10 June 2003

Intermittency study of a stressed-metal micro-spring sliding electrical contact

Electronic Components and Technology Conference

29 May 2003

Bent metal beams as probes for high-topography substrates in atomic force microscopy (AFM)

Micro- and Nanoengineering Conference 2002

16 September 2002

Fabrication of highly conductive micro-springs and their use as sliding-contact interconnects

Micro- and Nanoengineering Conference 2002

16 September 2002

Nano-spring arrays for high density interconnect

SPIE Micromachined Devices and Components VI

19 September 2000