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PARC publications
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novel electronics & systems
High current properties of a microspring contact for flip chip packaging
Hilton Head 2010
6 June 2010
Microspring characterization and flip chip assembly reliability
Best Paper Award at IMAPS 2009
1 November 2009
optoelectronics and optics
Nitride laser diodes with non-epitaxial cladding layers
IEEE Photonics Technology Letters
March 2010
Invited talk at Gallium Nitride Materials & Devices VI, SPIE Photonics West 2011
24 January 2011
Metal-clad nitride semiconductor laser diodes
8th International Conference on Nitride Semiconductors
22 October 2009
9th International Symposium on Semiconductor Light Emitting Devices
23 July 2012
Studies of hole transport in Mg-doped AlGaN layers for deep-ultraviolet light emitters
SPIE Photonics West
7 February 2013
printed and flexible electronics
High current properties of a microspring contact for flip chip packaging
Hilton Head 2010
6 June 2010
Microspring characterization and flip chip assembly reliability
Best Paper Award at IMAPS 2009
1 November 2009