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PROFILE:

 

Yunda Wang

Yunda Wang's background covers advanced manufacture, thermal systems, microelectromechanical systems (MEMS) technology and microsystem integration. Since joining PARC in 2013, he has developed an electrocaloric cooler by solving challenging manufacture and heat transfer issues. In the printed electronics area, he developed smart label-like printed liquid level sensors using additive manufacture technologies. Yunda has authored or co-authored more than 20 research articles, and one book chapter on thermal stress in MEMS. He has also presented, served as a reviewer or chaired sessions for international conferences or journals including ASME InterPACK, IMAPS and IEEE JMEMS.

Dr. Wang received his B.Eng. degree from Xi’an Jiaotong University, Xi’an, China and M.Eng. degree from Peking University, Beijing. He acquired his Ph.D. degree from the Department of Mechanical Engineering, University of Colorado at Boulder in December 2012, where he developed a polymer-based cryogenic cooler.
 

 

PARC publications

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2015

A heat-switch-based electrocaloric cooler

Applied physics letter

25 September 2015

 

 

 

other publications

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2014

A Monolithic Polyimide Micro Cryogenic Cooler: Design, Fabrication, and Test

Yunda Wang, Ryan Lewis, Ray Radebaugh, Martin M-H Lin, Victor M Bright, Yung-Cheng Lee Journal of Microelectromechanical Systems,

Thermal Stress in MEMS

Yunda Wang, Ming Kong, Yung-Chen Lee a book chapter of Encyclopedia of Thermal Stresses

2013

Study of mixed refrigerant undergoing pulsating flow in micro coolers with pre-cooling

Ryan Lewis, Yunda Wang, Hayley Schneider, YC Lee, Ray Radebaugh Cryogenics

Performance Analysis of an Integrated Micro Cryogenic Cooler and Miniature Compressor for Cooling to 200 K

Ryan Lewis, M-H Lin, Yunda Wang, Jill Cooper, Peter Bradley, Ray Radebaugh, Marcia Huber, YC Lee Journal of Thermal Science and Engineering Applications

Micro Cryogenic Coolers With Mixed Refrigerants

ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic a

The Development of Polymer-Based Planar Microcryogenic Coolers

Yunda Wang, Ryan Lewis, Martin M-H Lin, Ray Radebaugh, YC Lee Journal of Microelectromechanical Systems,

Experimental investigation of low-pressure refrigerant mixtures for micro cryogenic coolers

Ryan Lewis, Yunda Wang, Peter E Bradley, Marcia L Huber, Ray Radebaugh, YC Lee Cryogenics

A monolithic polyimide micro cryogenic cooler

Yunda Wang, R Lewis, R Radebaugh, YC Lee IEEE Transducers 2013

2012

Dual-polarized K/Ka-band planar log-periodic antenna

Antennas and Propagation (EUCAP), 2012 6th European Conference on

Enthalpy change measurements of a mixed refrigerant in a microcryogenic cooler in steady and pulsating flow regimes

Ryan J Lewis, Y-D Wang, M-H Lin, Marcia L Huber, Ray Radebaugh, YC Lee Cryogenics

Two Phase Flow Patterns and Cooling Power of Mixed Refrigerant in Micro Cryogenic Coolers

Ryan Lewis, Hayley Schneider, Yunda Wang, Ray Radebaugh, YC Lee ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels

Wafer-level processing for polymer-based planar micro cryogenic coolers

YD Wang, Ryan Lewis, M-H Lin, Ray Radebaugh, YC Lee IEEE MEMS 2012

2011

Micro cryogenic coolers for IR imaging

Ryan Lewis, Yunda Wang, Jill Cooper, Martin M Lin, Victor M Bright, YC Lee, Peter E Bradley, Ray Radebaugh, Marcia L Huber SPIE Defense, Security, and Sensing

A Polyimide Micro Heat Exchanger With a Suspended 3D Parallel Channel Structure for Cryogenic Application

Yunda Wang, Ryan Lewis, M-H Lin, Yiwei Yan, Ray Radebaugh, Peter Bradley, YC Lee ASME 2011 International Mechanical Engineering Congress and Exposition

Demonstration of an integrated micro cryogenic cooler and miniature compressor for cooling to 200 K

Ryan Lewis, M-H Lin, Yunda Wang, Jill Cooper, Peter Bradley, Ray Radebaugh, Marcia Huber, YC Lee ASME 2011 International Mechanical Engineering Congress and Exposition

2008

Characterizing Metallization Introduced Polysilicon Corrosion of Surface Micromachined Structures With Submicron Capacitive Gap

Yunda Wang, Ming Cai, Ying Wang, Jing Chen 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems

 

 

 

 

competencies