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Yunda Wang

Yunda has been with PARC since 2013. He is currently focusing on the development of advanced thermal MEMS structures and printing/additive manufacture for smart labels. He is an expert in design and fabrication of MEMS device and sensors for thermal system characterization. He has designed, fabricated and built a novel MEMS chip schale electrocaloric heat pump by solving challenging microscale thermal management techniques. He has also developed a polymer-based micro Joule-Thomson cryogenic cooler that involves realizing complicated microsystem with challenges due to large temperature change conditions. Yunda has authored or co-authored ~ 20 research articles, and 1  book chapter on topic of “thermal stress in MEMS”. He has also presented, severed as reviewers and chair sessions in several IEEE/ASME conferences.

Dr. Wang received his B.Eng. degree from Xi’an Jiaotong University, Xi’an, China and M.Eng. degree  from Peking University, Beijing. He aquired his Ph.D. degree from the Department of Mechanical Engineering, University of Colorado at Boulder in December 2012 where he developed a polymer-based cryogenic cooler.