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PROFILE:

 

Yunda Wang

Yunda Wang's background covers advanced manufacture, thermal systems, microelectromechanical systems (MEMS) technology and microsystem integration. Since joining PARC in 2013, he has developed an electrocaloric cooler by solving challenging manufacture and heat transfer issues. In the printed electronics area, he developed smart label-like printed liquid level sensors using additive manufacture technologies. Yunda has authored or co-authored more than 20 research articles, and one book chapter on thermal stress in MEMS. He has also presented, served as a reviewer or chaired sessions for international conferences or journals including ASME InterPACK, IMAPS and IEEE JMEMS.

Dr. Wang received his B.Eng. degree from Xi’an Jiaotong University, Xi’an, China and M.Eng. degree from Peking University, Beijing. He acquired his Ph.D. degree from the Department of Mechanical Engineering, University of Colorado at Boulder in December 2012, where he developed a polymer-based cryogenic cooler.
 

 

PARC publications

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2015

A heat-switch-based electrocaloric cooler

Applied physics letter

25 September 2015

 

 

 

 

 

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