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PROFILE:

 

 

PARC publications

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printed and flexible electronics

Wafer level packaging with soldered stress engineered micro-springs

IEEE Transactions on Advanced Packaging

May 2009

S-shaped double-spring structures for high stiffness and spring height

37th International Conference on Micro and Nano Engineering

19 September 2011

3D printed electronics

Digital Fabrication 2013

30 September 2013

Microspring characterization and flip chip assembly reliability

Best Paper Award at IMAPS 2009

1 November 2009

Pressure contact micro-springs in small pitch flip-chip packages

IEEE Transactions on Components and Packaging Technologies

December 2006

Stress-engineered MEMS

Seminar at Stanford

1 January 2008

 

 

 

 

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in the news   view all 

Micro Chiplets
8 August 2014 | MIT Technology Review

Next Trick for Laser Printers: Manufacturing Electronics
9 April 2013 | Techonomy

Tiny Chiplets: A New Level of Micro Manufacturing
8 April 2013 | The New York Times


 

 

events   view all 

2014FLEX - Flexible & Printed Electronics Conference & Exhibition
5 February 2014 - 6 February 2014 | Phoenix, AZ  

3D Printed Electronics
30 September 2013 | Seattle, WA