High current properties of a microspring contact for flip chip packaging

Hilton Head 2010

6 June 2010

Wafer level packaging with soldered stress engineered micro-springs

IEEE Transactions on Advanced Packaging

May 2009

Novel packaging with rematable spring interconnect chips for MCM

ECTC 2009

26 May 2009

Integration and packaging of a macrochip with silicon nanophotonic links

Invited paper for IEEE Journal of Selected Topics in Quantum Electronics

May 2011

Microspring characterization and flip chip assembly reliability

Best Paper Award at IMAPS 2009

1 November 2009

A package demonstration with solder-free compliant flexible interconnects

ECTC 2010

1 June 2010

Pressure contact micro-springs in small pitch flip-chip packages

IEEE Transactions on Components and Packaging Technologies

December 2006

High current properties of a microspring contact for flip chip packaging

Hilton Head 2010

6 June 2010

Wafer level packaging with soldered stress engineered micro-springs

IEEE Transactions on Advanced Packaging

May 2009

Novel packaging with rematable spring interconnect chips for MCM

ECTC 2009

26 May 2009

S-shaped double-spring structures for high stiffness and spring height

37th International Conference on Micro and Nano Engineering

19 September 2011

S-shaped double-spring structures for high stiffness and spring height

to be published in Microelectronic Engineering

21 April 2012

Fine-feature patterning of self-aligned polymeric thin-film transistors fabricated by digital lithography and electroplating

Applied Physics Letters

2 October 2006

Microspring characterization and flip chip assembly reliability

Best Paper Award at IMAPS 2009

1 November 2009

A package demonstration with solder-free compliant flexible interconnects

ECTC 2010

1 June 2010

Pressure contact micro-springs in small pitch flip-chip packages

IEEE Transactions on Components and Packaging Technologies

December 2006

Stress-engineered MEMS

Seminar at Stanford

1 January 2008