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PROFILE:

 

 

PARC publications

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printed and flexible electronics

Wafer level packaging with soldered stress engineered micro-springs

IEEE Transactions on Advanced Packaging

May 2009

S-shaped double-spring structures for high stiffness and spring height

37th International Conference on Micro and Nano Engineering

19 September 2011

3D printed electronics

Digital Fabrication 2013

30 September 2013

Microspring characterization and flip chip assembly reliability

Best Paper Award at IMAPS 2009

1 November 2009

Pressure contact micro-springs in small pitch flip-chip packages

IEEE Transactions on Components and Packaging Technologies

December 2006

Stress-engineered MEMS

Seminar at Stanford

1 January 2008

 

 

 

 

 

competencies

 

in the news   view all 

DARPA Picks 10 to Build Nano-based Products
7 January 2016 | Defense Systems

Chips off the Old Block
6 December 2014 | The Economist

Micro Chiplets
8 August 2014 | MIT Technology Review


 

 

events   view all 

Visit us at the ARPA-E Energy Innovation Summit 2016
29 February 2016 - 2 March 2016 | Washington, DC  

MicroJet Array for Ballistic Drug Delivery
13 October 2015 | Boston, MA