Applications of stress-engineered MEMS

Stanford ME342 MEMS Seminar

13 July 2005

Applications of stress-engineered MEMS

Bay Area MEMS Journal Club

11 November 2004

Bent metal beams as probes for high-topography substrates in atomic force microscopy (AFM)

Micro- and Nanoengineering Conference 2002

16 September 2002

Chip on glass bonding using StressedMetal™ Technology

2005 SID International Symposium Digest of Technical Papers

24 May 2005

Fine-feature patterning of giant-area flexible electronics by microcontact printing and digital lithography

Proceedings of the Spring 2005 Materials Research Society Meeting

28 March 2005

Fine-feature patterning of self-aligned polymeric thin-film transistors fabricated by digital lithography and electroplating

Applied Physics Letters

2 October 2006

High current properties of a microspring contact for flip chip packaging

Hilton Head 2010

6 June 2010

High voltage thin film transistors integrated with MEMS

Transducers '05, Digest of Technical Papers

5 June 2005

High voltage thin film transistors integrated with MEMS

Sensors and Actuators A

1 January 2006

Integration and packaging of a macrochip with silicon nanophotonic links

Invited paper for IEEE Journal of Selected Topics in Quantum Electronics

May 2011

Intermittency study of a stressed-metal micro-spring sliding electrical contact

Electronic Components and Technology Conference

29 May 2003

Intracellular calcium waves in bone cell networks under single cell nanoindentation

Molecular & Cellular Biomechanics

1 June 2006

Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology

12th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers '03)

10 June 2003

Microspring characterization and flip chip assembly reliability

Best Paper Award at IMAPS 2009

1 November 2009

Novel packaging with rematable spring interconnect chips for MCM

ECTC 2009

26 May 2009

A package demonstration with solder-free compliant flexible interconnects

ECTC 2010

1 June 2010

Pressure contact micro-springs in small pitch flip-chip packages

IEEE Transactions on Components and Packaging Technologies

December 2006

S-shaped double-spring structures for high stiffness and spring height

37th International Conference on Micro and Nano Engineering

19 September 2011

S-shaped double-spring structures for high stiffness and spring height

to be published in Microelectronic Engineering

21 April 2012

Scanning probes with tall tips for high aspect ratio MEMS metrology

Solid State Sensor, Actuator and Microsystems Workshop

2 June 2002

Scanning stressy probes - concept and use in atomic force microscopy

Scanning Probe Microscopy, Sensors and Nanostructures Conference 2002

26 May 2002

Solder-free pressure contact micro-springs in high-density flip-chip packages

55th Electronic Components and Technology Conference

31 May 2005

Stress-engineered MEMS

Seminar at Stanford

1 January 2008

Stressed metal probes for atomic force microscopy

Applied Physics Letters

14 October 2002

Stressed-metal NiZr probes for atomic force microscopy

Microelectronic Engineering

June 2003

Wafer level packaging using StressedMetal™ technology

IMAPS 2004

14 November 2004

Wafer level packaging with soldered stress engineered micro-springs

IEEE Transactions on Advanced Packaging

May 2009