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PARC publications

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2013

High carrier injection efficiency at high carrier densities for UV light emitting devices

International Conference on Nitride Semiconductors

26 August 2013

Microspring characterization and flip chip assembly reliability

IEEE Transactions on Components and Packaging Technologies

February 2013

2012

Deep UV AlGaN lasers

9th International Symposium on Semiconductor Light Emitting Devices

23 July 2012

Towards sub-300 nm AlGaN laser diodes on bulk AlN substrates

Spring Meeting of the German Physical Society

24 March 2012

Optically pumped UV lasers grown on bulk AlN substrates

physica status solidi c

February 2012

Sub-300 nm AlGaN lasers on bulk AlN substrates

SPIE Photonics West 2012

23 January 2012

2011

Towards sub-300 nm laser diodes on bulk AlN substrates

International Semiconductor Device Research Symposium

7 December 2011

Optically pumped UV lasers grown on bulk AlN substrates

International Conference on Nitride Semiconductors

12 July 2011

InAlGaN optical emitters: laser diodes with non-epitaxial cladding layers and ultraviolet light-emitting diodes

Invited talk at Gallium Nitride Materials & Devices VI, SPIE Photonics West 2011

24 January 2011

Optical polarization of UV-A and UV-B (In)(Al)GaN multiple quantum well light emitting diodes

Gallium Nitride Materials & Devices VI at SPIE Photonics West 2011

22 January 2011

2010

Nitride laser diodes with non-epitaxial cladding layers

IEEE Photonics Technology Letters

March 2010

Lasing of semi-polar InGaN/GaN(1122) heterostructures grown on m-plane sapphire substrates

SPIE Photonics West 2010: Novel In-Plane Semiconductor Lasers IX

25 January 2010

2009

Microspring characterization and flip chip assembly reliability

Best Paper Award at IMAPS 2009

1 November 2009

Metal-clad nitride semiconductor laser diodes

8th International Conference on Nitride Semiconductors

22 October 2009

Optically-pumped lasing of semipolar InGaN/GaN(1122) heterostructures

International Conference on Nitride Semiconductors (ICNS 8)

2009 October 18

Wafer level packaging with soldered stress engineered micro-springs

IEEE Transactions on Advanced Packaging

May 2009

Silver-clad nitride semiconductor laser diode

Applied Physics Letters

26 January 2009

2008

Stress-engineered MEMS

Seminar at Stanford

1 January 2008

2006

Pressure contact micro-springs in small pitch flip-chip packages

IEEE Transactions on Components and Packaging Technologies

December 2006

2005

Applications of stress-engineered MEMS

Stanford ME342 MEMS Seminar

13 July 2005

Solder-free pressure contact micro-springs in high-density flip-chip packages

55th Electronic Components and Technology Conference

31 May 2005

Chip on glass bonding using StressedMetal™ Technology

2005 SID International Symposium Digest of Technical Papers

24 May 2005

2004

Applications of stress-engineered MEMS

Bay Area MEMS Journal Club

11 November 2004

2003

Out-of-plane high Q inductors on low resistance silicon

Journal of Microelectromechanical Systems

30 December 2003

Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology

12th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers '03)

10 June 2003

Intermittency study of a stressed-metal micro-spring sliding electrical contact

Electronic Components and Technology Conference

29 May 2003

Low-noise monolithic oscillator with an integrated three-dimensional inductor

IEEE International Solid-State Circuits Conference (2003 ISSCC)

9 February 2003

High-Q RF coils on silicon integrated circuits

MEMS Components and Applications for Industry, Automobiles, Aerospace and Communication II

28 January 2003

2002

Self-assembled out-of-plane high-Q integrated inductors

IEEE International Electron Devices Meeting Technical Digest

8 December 2002

Stressed metal nanosprings

Advanced Packaging

1 November 2002

On-chip out-of-plane high-Q inductors

IEEE Lester Eastman Conference on High Performance Devices

6 August 2002

Self-assembled out-of-plane high Q inductors

Solid State Sensor, Actuator and Microsystems Workshop

2 June 2002

2001

Compliant cantilevered spring interconnects for flip-chip packaging

Proceedings of the 51st Electronic Components and Technology Conference (ECTC)

29 May 2001

2000

Nano-spring arrays for high density interconnect

SPIE Micromachined Devices and Components VI

19 September 2000

1999

1998

Wafer fusion of infrared diodes to GaN light emitting heterostructures

IEEE Photonics Technology Letters

1 November 1998

Independently addressable VCSEL arrays on 3Mm pitch

IEEE Photonics Technology Letters

1 July 1998

810 nm linear vertical cavity laser arrays on 3 micron pitch

6th Annual Device Research Conference Digest

22 June 1998

1997

Phase separation in InGaN/GaN multiple quantum wells

Materials Research Society Symposium

1 December 1997

Phase separation in annealed InGaN multiple quantum wells

International Conference on Nitride Semiconductors

27 October 1997

 

 

 

 

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Tiny Springs Could Reduce Microchip Waste
13 July 2010 | Technology Review


 

events   view all 

SPIE Photonics West 2014
4 February 2014 - 6 February 2014
The Moscone Center | San Francisco, CA
 

SPIE Photonics West - visit PARC's booth
5 February 2013 - 7 February 2013 | San Francisco, CA