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Fred Endicott

Fred Endicott is involved in research to enable new printing technologies.  His primary area of expertise supporting this research is scanning electron microscopy and the related energy-dispersive x-ray spectroscopy, for which Fred has had primary responsibility for over 20 years.  Another area of expertise is setting up and implementing new instrumentation, both hardware and software.

Prior to joining PARC, Fred was employed at Fairchild Semiconductor as a process engineer supporting a linear integrated circuit wafer fabrication facility, and at Mallory Metallurgical Company as an engineer supporting manufacturing.

Fred received B.S. and M.S degrees in Metallurgy and Materials Sciences from MIT in 1971.  He has co-authored ten patents and received numerous awards including the Golden Acorn award, PARC's highest award, in 2002 for work on ballistic aerosol marking.


PARC publications

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3D printed electronics

Digital Fabrication 2013

30 September 2013

Printed organic integrated circuits for sensor systems

International Conference on Flexible and Printed Electronics (ICFPE)

11 September 2013

Ballistic aerosol marking

17th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2013)

19 June 2013

Flexible, large-area sensor circuits fabricated by additive printing

2013 and Beyond: Flexible Electronics Symposium at TMS Annual Meeting

4 March 2013




Extended time bias stress effects in polymer transistors

Journal of Applied Physics

1 December 2006

Environmental stability of polymeric thin-film transistors

SPIE Optics and Photonics

1 August 2006

Effects of mechanical stress on printed polymer-based TFTs on flexible display backplanes

2006 Gordon Research Conference (GRC) on Thin Films

30 July 2006

All additive ink jet printed backplanes for displays

34th Annual Northern California Electronic Materials Symposium

28 April 2006

Printed polymer-based TFTs for flexible display backplanes

USDC Flexible Display & Microelectronics Conference

7 February 2006

Vertically segregated polymer blends: their use in organic electronics

Journal of Macromolecular Science C: Polymer Reviews

January - March 2006





events   view all 

3D Printed Electronics
30 September 2013 | Seattle, WA  

Printed Organic Integrated Circuits for Sensor Systems
11 September 2013 | JeJu Island, Korea  

Ballistic Aerosol Marking
16 June 2013