Fred Endicott is involved in research to enable new printing technologies. His primary area of expertise supporting this research is scanning electron microscopy and the related energy-dispersive x-ray spectroscopy, for which Fred has had primary responsibility for over 20 years. Another area of expertise is setting up and implementing new instrumentation, both hardware and software.
Prior to joining PARC, Fred was employed at Fairchild Semiconductor as a process engineer supporting a linear integrated circuit wafer fabrication facility, and at Mallory Metallurgical Company as an engineer supporting manufacturing.
Fred received B.S. and M.S degrees in Metallurgy and Materials Sciences from MIT in 1971. He has co-authored ten patents and received numerous awards including the Golden Acorn award, PARC's highest award, in 2002 for work on ballistic aerosol marking.
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3D Printed Electronics
30 September 2013 | Seattle, WA
Printed Organic Integrated Circuits for Sensor Systems
11 September 2013 | JeJu Island, Korea
Ballistic Aerosol Marking
16 June 2013