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PEOPLE:
- MEMS, packaging, and printing
- microsprings for integrated circuit packaging and testing; novel viscous liquid printing concepts; xerographic micro-chip assembly
- thin-film transistor integration with MEMS; large-area printed organic electronics research
- Ph.D. and M.S., Electrical Engineering, & M.S. in management science and engineering, Stanford University; B.S., engineering physics, U.C. Berkeley
- microsystems work situated where physics, semiconductor technology, materials science, electrical engineering, and chemical engineering intersect
- applications of "StressedMetal" MEMS to chip packaging, micro-optics, and micro-switches
- fabricated calorimetric enthalpy arrays for proteomics and drug discovery and introduced novel He also introduced novel microfluidic drop mixing technique
- leads client services sales and transaction team for all of PARC
- helps create new opportunities, shape and spearhead commercial partnerships, and enable the commercialization of PARC’s breakthrough technologies
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M.S. in Intellectual Capital Management and a B.S. in Industrial Engineering and Management from Chalmers University of Technology in Gothenburg, Sweden
- large-area electronic materials and devices
- printing technologies to replace photolithographic techniques
- solution-based organic materials to create large-area transistor and sensor arrays
- previous work on digital x-ray imaging commercialized through PARC spin-off dPix
- holds 53 patents and published more than 350 papers
- American Physical Society David Adler Award; American Institute of Physics prize for Industrial Applications of Physics
- Ph.D., B.S., Physics, Cambridge University
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- Big Data
- Clean Water
- Cleantech and Energy
- Content-Centric Networking
- Contextual Intelligence
- Design and Digital Manufacturing
- Health and Wellness
- Innovation Services
- Intelligent Automation
- Optoelectronics and Optics
- Printed and Flexible Electronics
