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PEOPLE:

 

Eugene Chow
  • MEMS, packaging, and printing
  • microsprings for integrated circuit packaging and testing; novel viscous liquid printing concepts; xerographic micro-chip assembly
  • thin-film transistor integration with MEMS; large-area printed organic electronics research
  • Ph.D. and M.S., Electrical Engineering, & M.S. in management science and engineering, Stanford University; B.S., engineering physics, U.C. Berkeley

 

Markus Larsson
Markus Larsson
Vice President, Global Business Operations

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  • leads client services sales and transaction team for all of PARC
  • helps create new opportunities, shape and spearhead commercial partnerships, and enable the commercialization of PARC’s breakthrough technologies
  • M.S. in Intellectual Capital Management and a B.S. in Industrial Engineering and Management from Chalmers University of Technology in Gothenburg, Sweden

 

Ping Mei
  • printed electronics for digital processing and device integration toward low-cost manufacturing fabrication and novel device applications
  • passion for developing disruptive technologies that may improve our lives
  • Ph.D. and B.S., Physics, Rutgers University and Peking University respectively
  • 60 issued U.S. patents and more than 60 journal publications and book chapters

 

Nazly Pirmoradi
  • Current research focuses on novel micro- and nano-systems and integrated 3D smart objects and sensors for healthcare and biomedical applications
  • broad experience in MEMS, bioMEMS, lab-on-a-chip systems, microfluidics, and the lifecycle of advance biomedical microdevice development: including design, mechanics of materials, material and process development, and device and biological response study.
  • Developed a battery-less MEMS ocular implant for controlled and on-demand delivery of drug for treatment of Diabetic Retinopathy
  • Ph.D. and a M.A.Sc in Mechanical Engineering from the University of British Columbia; B.Sc. in Mechanical Engineering from University of Tehran.

 

Steve Ready
  • high-accuracy ink jet printing
  • a-, poly-, and crystalline silicon and associated applications
  • large-area arrays for optical and x-ray imaging, displays, and organic semiconductor materials and devices

 

Jonathan Rivnay
  • Sensor materials/devices for bioelectronics and integration for flexible-hybrid electronic systems
  • Materials science and conjugated polymer microstructure/device physics
  • Ph.D., M.S., Stanford University; B.S., Cornell University

 

David Eric Schwartz
  • analog and digital CMOS circuit design, biosensing, and software engineering
  • interface between electrical engineering, biochemistry, electrochemistry
  • B.S., Mathematics, Brown University; Ph.D., Electrical Engineering, Columbia University

 

Clinton J. Smith
  • precision sensor system research and development
  • nanofabrication, photonics/optics, spectroscopy, device packaging, biosensing, data analysis, algorithm development, and simulations and modeling of physical systems
  • carbon nanotube-based sensor networks for measuring methane emissions as part of the ARPA-E MONITOR program.
  • Ph.D., Electrical Engineering, Princeton University; B.S., Computer Engineering, Georgia Institute of Technology
  • Nanotechnology for Clean Energy IGERT fellowship at Princeton

 

Bob Street
  • large-area electronic materials and devices
  • printing technologies to replace photolithographic techniques
  • solution-based organic materials to create large-area transistor and sensor arrays
  • previous work on digital x-ray imaging commercialized through PARC spin-off dPix
  • holds 78 patents and published more than 350 papers
  • American Physical Society David Adler Award; American Institute of Physics prize for Industrial Applications of Physics
  • Ph.D., B.S., Physics, Cambridge University

 

Janos Veres
  • flexible, printed, and hybrid electronics from development to commercialization
  • radically new manufacturing concepts to create electronics in new form factors
  • expert in the physics of organic semiconductors and novel electronic devices
  • author on over 30 patents and 50 publications
  • Ph.D., Solid State Electronics, Imperial College

 

Yunda Wang
  • extensive background in MEMS fabrication and microsystems integration
  • currently focusing on the development of advanced MEMS structures
  • Ph.D. degree from the Department of Mechanical Engineering, University of Colorado at Boulder; M.Eng. degree  from Peking University, Beijing; B.Eng. degree from Xi’an Jiaotong University

 

Yong Zhang
  • additive manufacturing technologies, design and fabrication of microdevices, microrobotic manipulation
  • printed methane sensor networks, assembly of microchips and particles, printing of smart objects
  • Ph.D., electrical and computer engineering, University of Toronto; M.S. and B.S., mechatronics engineering, Harbin Institute of Technology.