home › event - high current properties of a microspring contact for flip chip packaging


High current properties of a microspring contact for flip chip packaging

Hilton Head Workshop 2010: A Solid-State Sensors, Actuators and Microsystems Workshop

6 June 2010 - 10 June 2010
Hilton Head Island, South Carolina, USA



The high current properties of a micro spring pressure contact are characterized. The spring has large compliance (>30um) compared to other packaging technologies and fits in a 180um pitch 2d array. Daisy chains of spring contacts in a silicon package show stable resistances for 250 mA DC soaks at 65C. At 1 amp, failure near the spring tip or body was observed. Simultaneous force and resistance measurements suggest there is no spring force softening. Finite element modeling is performed to study the current and temperature distribution and provide failure mode insight. The results suggest a 10mg (100uN) micro spring with large compliance can be reliable for high current applications.


upcoming events   view all 

Open Innovation to Manage Risks in Technology and Business
Janos Veres
28 June 2016 | Redwood City, CA
Conferences & Talks  

Designing for Longevity: The 10,000 Year Clock Project
Alexander Rose
30 June 2016 | George E. Pake Auditorium, PARC
PARC Forum  

Industrial Applications of Metamaterials
Bernard Casse
25 July 2016 - 26 July 2016 | Malaga, Spain
Conferences & Talks  

Relational Similarity Machines
Ryan Rossi, Rong Zhou
14 August 2016
Conferences & Talks