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EVENT:

Microspring Interconnects for Electronics Packaging & Testing
Conferences & Talks

 

description

Reviews last 10 years of micro spring for electronics packaging work at PARC...

 

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Innovation and AI
Tolga Kurtoglu
5 November 2017 | Lisbon, Portugal
Conferences & Talks  

Leveraging RF power for flexible-hybrid electronics
6 November 2017
Conferences & Talks  

The Future of Electronics
Mike Kuniavsky, Janos Veres
14 November 2017 | San Francisco, CA
Conferences & Talks  

Printed Electronics USA 2017 - Visit PARC's Booth #X22
Ross Bringans, Markus Larsson, Nicholas Meehan, Janos Veres
15 November 2017 - 16 November 2017 | Santa Clara, CA
Conferences & Talks