2013 FLEX -- visit PARC's booth
Ross Bringans, Markus Larsson, Miyuki Ryder, Janos Veres, Gregory Whiting, David Eric Schwartz, Tolga Kurtoglu
2013 FLEX
29 January 2013 - 1 February 2013 | Phoenix, AZ
Conferences & Talks  

PE USA 2012
Janos Veres
Printed Logic Circuits
6 December 2012 | Santa Clara, CA
Conferences & Talks  

PE USA 2012 -- visit PARC's booth
Ross Bringans, Markus Larsson, Miyuki Ryder, Janos Veres, Leon Wong
PE USA 2012 event web site
5 December 2012 - 6 December 2012 | Santa Clara, CA
Conferences & Talks  

Printed Electronics Building Blocks
Janos Veres
Stanford Photonics Research Center 2012 Annual Symposium
18 September 2012
Conferences & Talks  

Flexible large-area electronics made by additive printing
Tse Nga (Tina) Ng
US Frontiers of Engineering Symposium
13 September 2012
Conferences & Talks  

Printed Circuits and Sensors for Flexible Electronic Devices
Gregory Whiting, Invited Talk, Tse Nga (Tina) Ng, Author, Leah Lucas Lavery, Author, David Eric Schwartz, Author, Jurgen Daniel, Author, Scott Uhland, Author, Beverly Russo, Author, Brent Krusor, Author, Janos Veres, Author
International Conference on Flexible and Printed Electronics
6 September 2012 | Tokyo, Japan
Conferences & Talks  

Flexible, large-area sensor circuits fabricated by additive printing
Tse Nga (Tina) Ng, David Eric Schwartz, Gregory Whiting, Bob Street, Janos Veres
2012 NanoTechnology for Defense Conference
8 August 2012
Conferences & Talks  

Ink and substrate interactions in printed field-effect transistors
Gregory Whiting, Invited Talk, Tse Nga (Tina) Ng, Author, Brent Krusor, Author, Beverly Russo, Author, Janos Veres, Author
Printing Electronics - Ink and Substrate Interactions
2 August 2012 | Kalamazoo, MI
Conferences & Talks  

Scalable logic-addressed memory: printing integration of organic complementary logic and ferroelectric memory
Tse Nga (Tina) Ng, presenter, David Eric Schwartz, Leah Lucas Lavery, Gregory Whiting, Beverly Russo, Brent Krusor, Janos Veres
Large-area, Organic and Printed Electronics Convention (LOPEC)
20 June 2012
Conferences & Talks  

Integrating Through-Silicon Vias with Solder Free, Compliant Interconnects for Novel, Large Area Interposers
Eugene Chow, Author
Electronic Components and Technology Conference (ECTC)
29 May 2012 | San Diego, CA
Conferences & Talks