Ballistic Aerosol Marking
Armin Volkel, Greg Anderson, Fred Endicott, Ashish Pattekar, Eugene Chow
Transducer
16 June 2013
Conferences & Talks  

Integrating Through-Silicon Vias with Solder Free, Compliant Interconnects for Novel, Large Area Interposers
Eugene Chow, Author
Electronic Components and Technology Conference (ECTC)
29 May 2012 | San Diego, CA
Conferences & Talks  

Heterogeneous Integration with Microsprings
Eugene Chow, Presenter, Chris Chua, Author, Dirk De Bruyker, Author
DARPA Proposers Day Workshop for DAHI BAA
17 April 2012 | Arlington , DC
Conferences & Talks  

Microspring Interconnects for Electronics Packaging & Testing
Eugene Chow
ASME InterPACK 2011
6 July 2011
Conferences & Talks  

Scalable Microsprings for Integrated Test and Packaging
Eugene Chow, Presenter
ASME InterPACK
6 July 2011 | Portland, OR
Conferences & Talks  

Microspring Interconnects for Electronics Packaging
Eugene Chow
GOMACTECH11- Government Microcircuit Applications & Critical Technology Conference
21 March 2011 | Orlando, FL
Conferences & Talks  

Scalable Microspring Contacts for Integrated Test and Packaging
Eugene Chow
Known Good Die (KGD) Workshop
28 October 2010 - 29 October 2010 | Austin, TX
Conferences & Talks  

Microspring contacts for integrated test and packaging
Eugene Chow
2010 International Wafer-Level Packaging Conference (IWLPC)
11 October 2010 - 14 October 2010 | Santa Clara, CA
Conferences & Talks  

High current properties of a microspring contact for flip chip packaging
Dirk De Bruyker, Eugene Chow
Hilton Head Workshop 2010: A Solid-State Sensors, Actuators and Microsystems Workshop
6 June 2010 - 10 June 2010 | Hilton Head Island, SC
Conferences & Talks  

A Package Demonstration with Solder Free Compliant Interconnects
Eugene Chow, Bowen Cheng, Dirk De Bruyker
Electronic Components and Technology Conference
1 June 2010 - 4 June 2010 | Las Vegas, NV
Conferences & Talks