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Large-Area Electronics
Enabling large area applications with novel functionality and reduced manufacturing cost

Large area electronics is a rapidly growing $100B business, dominated by current and emerging applications in:
-   flat panel displays for TV, monitors, lap-tops and cell-phones;
-   solar cells and x-ray detectors;
-   RFID (radio frequency ID); and
-   e-paper and signage.

PARC Work

PARC developed core technology in amorphous silicon (a-Si) and low-temperature poly-silicon (LTPS) over the past few decades, and pioneered x-ray detector technology – which resulted in a major spinoff, dpiX (acquired by Siemens Medical/ Phillips Medical/ Thomson-CSF, Planar Systems, and Varian Medical).

Current work includes:

"Our ability to realize the engineering prototypes in a reasonable time frame is enhanced tremendously by our relationship with PARC" -- UniPixel, in EE Times
  • Organic semiconductors — Enabling low-cost backplane manufacturing through polymer semiconductors made in solution and deposited by spin-coating or jet-printing. PARC expertise includes organic materials characterization, thin film transistors (TFT), and optical sensors.
     
  • Printed Electronics Fabricating TFT arrays in custom-built jet-printing systems. Two printing techniques PARC researchers developed are digital lithography (where a wax etch mask is printed) and all-additive printing (where all the active materials are printed).
     
  • Flexible Electronics Enabling new display functionality through flexible substrates. PARC has resolved most of the challenging technical issues involved, and has demonstrated reflective displays on plastic (using both low temperature a-Si and printed organic semiconductors), and LTPS OLED displays on steel foil.
     
  • a-Si & LTPS — PARC researchers continue to develop innovative systems based on a-Si and LTPS, including high-performance pixel amplifiers for image sensors; low temperature a-Si for plastic substrates; and novel device structures.

R&D and Prototyping Facility Resources

PARC has a versatile process line that allows rapid prototyping of large area electronics concepts -- with a full range of large area processing for a-Si, LTPS, and organics. The line can process: 4”, 6”, and 8” glass, steel, foil, and plastic substrates. More...

Large Area Electronics Research at PARC
25 years of industry contributions

1980s

  • Foundational research on doping and hydrogenation of amorphous Silicon (a-Si) for large area electronics

1990s

  • Pioneered the development of flat panel x-ray imaging
  • dpiX spun out to commercialize a-Si circuits for ultra-high resolution displays & medical x-ray imagers
  • Laser crystallization of a-Si for low temperature polysilicon thin film transistors (TFTs)

2000s

  • Development of first a-Si and polymer semiconductor transistor arrays entirely patterned using jet printing
  • Poly-Si TFT/OLED on flexible stainless steel substrates (with Universal Display Corp.)‏
  • First demonstration of all-additive printed polymer TFTs
  • Demonstrated 100V low-temperature poly-silicon (LTPS) array for controlling MEMS displays 

 

 

 

 

 

 

BUSINESS CONTACT
Nitin Parekh
Director of Business Development, Hardware Systems & Electronic Materials and Devices Laboratories
650-812-4132
RELATED WEBPAGES

Jet-printed Plastic Transistors

Printing (non-paper applications)

NEWS

PARC to develop sensor tape technology to track exposure to explosive blasts

Amorphous-silicon approach beats the temperature challenge, Laser Focus World

Manufacturing progress key to flexible electronics' success, SmallTimes

Universal Display Announces Full-Color AMOLED Display Prototype on Flexible Metal Foil, Nikkei Electronics Asia

New Twist on LCD Displays, Computerworld

Rollable OLED Displays, Geek.com

OLED Goes to Metallic Substrate, Electronic News

PARC, Uni-Pixel team on MEMS display technology, EE Times

Chemists work on plastic promise, BBC News

Universal Display Corporation Awarded Contract from the U.S. Army CERDEC to Develop Infrared PHOLED Display

Just One Word -- Plastics, Special report from IEEE Spectrum

   

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