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Markus Larsson in the news
UC Berkeley, PARC, Thinfilm Electronics pursue printed sensors with FlexTech Alliance grant
22 August 2012 | Solid State Technology
"An integrated printed sensor system is under development with a new grant from FlexTech Alliance, which supports displays and flexible, printed electronics. The project leverages commercial development work currently underway between PARC and Thinfilm Electronics on designing a printed sensor platform and will integrate temperature sensing as well as assess an oxygen sensor being developed at the University of California at Berkeley.
Earlier this year, Thinfilm Electronics and PARC won the FlexTech Alliance Innovation Award for the world's first working prototype of a printed, non-volatile memory device addressed with complementary organic circuits, the equivalent of CMOS circuitry."
Global Flexible Electronics Market to Reach US$25.9 Billion by 2018, According to New Report by Global Industry Analysts, Inc.
19 July 2012 | Digital Journal
"Flexible electronics is an emerging field of science and manufacturing technology, which enables planting of electronic devices onto conformable plastic substrates. ...driven by the global demand for lighter and smaller electronic products that consume lesser power. Due to the fact that these devices are more shock resistant, cost-effectively manufactured, and can be flexed or bended, they have the capability of being integrated into portable devices, clothing, and packaging materials.
…Key players profiled in the report include, 3M Flexible Circuit Foundry, Applied Materials, Inc., Citala Ltd., Cambridge Display Technology Ltd., E Ink Holdings, Inc., Infinite Corridor Technology, Konarka Technologies, Inc., MC10, Inc., PARC, Versatilis, LLC, among others."
Thinfilm Pairs Up With Packaging Giant Bemis To Create Labels That Know Things
10 July 2012 | Forbes
by Connie Guglielmo
"Thinfilm Electronics moved a step closer to making the 'Internet of Things' a reality, announcing a deal with U.S. packaging giant Bemis Co. today to create a printed electronics system for consumer product, healthcare and food companies who want to tag, track and collect information wirelessly about the products they ship.
What does that mean exactly? Thinfilm has been working on low-cost sensor tags containing rewritable memory that can be placed on anything...and that can collect a bevy of information.
...Thinfilm, which paired up with Xerox’s PARC R&D spin off to help develop its printed electronics technology, has already been working on creating 'inexpensive, integrated time-temperature sensors for use in monitoring perishable goods and pharmaceuticals'. The deal with Bemis builds on that work to create a 'customizable sensor platform' that Bemis can adapt for its customers. Thinfilm and Bemis said they plan to make the Bemis Intelligent Packaging Platform available next year."
The Internet of things is coming to a grocery store near you
9 July 2012 | GigaOM
by Stacey Higginbotham
"Thin Film Electronics, a company that makes wafer-thin printed circuits that can be built into packaging materials, and Bemis, a manufacturer of both consumer products and wholesale packaging, have signed an agreement that will add circuits to your cereal box. Or maybe sensors to your salad bags. Or digital intelligence to disposable diapers.
The Oslo-based Thinfilm has been in business since the mid-90s. It has been manufacturing thin-film memory chips that provide about 20 bits of storage, which were used in toys and games. But it has been adding more memory and has a partnership with Xerox PARC that added transistors to its circuit, thereby giving its chips enough intelligence to track inventory or send environmental data from a sensor back to the network. ...the idea of smarter circuits that are still cheap enough to be used in packaging are integral to creating an internet of things."
PARC showcases business models, not products, at 10 year anniversary
29 April 2012 | Ars Technica
by Nathan Mattise
"The message of the day was clear with the first words to greet guests at the registration table (via both conference workers and a commemorative bookmark). 'Just wanted to let you know, "Xerox PARC" is so 10 years ago. Today, we're "PARC, a Xerox company".'
PARC's Power of 10 is a year-long series of events, including public-friendly guest presentations and this half-day conference, to commemorate the company's first ten years of independent operation. In 2002 Xerox incorporated PARC as an independent, wholly owned subsidiary, shifting the R&D pioneers toward an open innovation business model that took center stage on Thursday.
...Chesbrough's point was best emphasized after his presentation. The rest of the afternoon featured panels with representatives from a few PARC-collaborators. They all shared their projects, but the most eye-catching were Nicole Tricoukes, Senior Maverick at Motorola Solutions, and Davor Sutija, CEO of Thin Film."
The age of flexible electronics is upon us
16 April 2012 | VentureBeat
by Dean Takahashi
"It has taken decades to reach this point because it requires the invention of new semiconductor manufacturing technologies, which have to be reused in ways that apply to the new kinds of materials. The good thing is that putting a little bit of electronics into flexible or wearable materials can result in a lot of new applications that don’t cost all that much to build. Flexible electronics is still looking for home-run applications, but it’s not as pie-in-the sky as it sounds. The manufacturing has improved to the point where simple memory devices cost just pennies."
On moving printed electronics from enabling technology to application
22 November 2011 | Printed Electronics World
by Raghu Das, CEO of IDTechEx
"IDTechEx recently visited PARC in California and learnt of its business model today, culture, and legacy pioneering technological change...among many other industry contributions.
Below, I share some updates on what IDTechEx has been observing at PARC. Taken together, these updates convey an important movement beyond the enabling materials, processes, equipment, and components."