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Chris Chua in the news
Tiny Springs Could Reduce Microchip Waste
A new manufacturing approach could end the junking of several chips when one fails.
13 July 2010 | Technology Review
by Tom Simonite
"For now, the collaborators are developing their springy approach for the high-performance processors used in supercomputers or high-end servers. These chips are combined in closely packed groups known as multichip modules. Such modules need the processors to be packed closely together in order to speed the transfer of signals between them...They showed that their approach works on a test chip from Oracle that simulates the electrical and thermal behavior of a high-end processor."