home › resources & publications › scanning probes with tall tips for high aspect ratio mems metrology
TECHNICAL PUBLICATIONS:
Scanning probes with tall tips for high aspect ratio MEMS metrology
- Solid State Sensor, Actuator and Microsystems Workshop
citation
Chow, E. M. ; Hantschel, T. ; Fork, D. K. Scanning probes with tall tips for high aspect ratio MEMS metrology. Solid State Sensor, Actuator and Microsystems Workshop; 2002 June 2-6; Hilton Head; SC; USA.
PARC author
related publications
Wafer level packaging with soldered stress engineered micro-springs
Pressure contact micro-springs in small pitch flip-chip packages
Applications of stress-engineered MEMS
Solder-free pressure contact micro-springs in high-density flip-chip packages
Chip on glass bonding using StressedMetal™ Technology
Wafer level packaging using StressedMetal™ technology
subscribe
