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Stressed-metal NiZr probes for atomic force microscopy

  • Microelectronic Engineering
 
 
citation

Hantschel, T. ; Chow, E. M. ; Rudolph, D. ; Shih, C. ; Wong, L. ; Fork, D. K. Stressed-metal NiZr probes for atomic force microscopy. Microelectronic Engineering. 2003; 67-68 (16): 803-809.

PARC author

Eugene Chow

 

publications

Bent metal beams as probes for high-topography substrates in atomic force microscopy (AFM)

Chip on glass bonding using StressedMetal™ Technology

Wafer level packaging using StressedMetal™ technology

Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology

Intermittency study of a stressed-metal micro-spring sliding electrical contact

Stressed metal probes for atomic force microscopy

Wafer level packaging with soldered stress engineered micro-springs

Pressure contact micro-springs in small pitch flip-chip packages

Applications of stress-engineered MEMS

Solder-free pressure contact micro-springs in high-density flip-chip packages

 

 

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