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TECHNICAL PUBLICATIONS:
Stressed metal nanosprings
- Advanced Packaging
citation
Linder, C.; Fork, D. K. ; Chua, C. L. ; Van Schuylenbergh, K. ; VanderStraeten, C.; Plesa, D. Stressed metal nanosprings. Advanced Packaging. 2002 November.
PARC author
related publications
Nanosprings - new dimensions in sputtering
Wafer level packaging with soldered stress engineered micro-springs
Pressure contact micro-springs in small pitch flip-chip packages
Applications of stress-engineered MEMS
Solder-free pressure contact micro-springs in high-density flip-chip packages
Chip on glass bonding using StressedMetal™ Technology
