Nano-spring arrays for high density interconnect

• SPIE Micromachined Devices and Components VI

A new type of compliant interconnect derived from a thin metal film fabricated with a controlled stress profile is being developed for flip- flop interconnects and probing devices. Interconnections have been demonstrated on lateral pitches as tight as 6 microns. The interconnect is highly elastic and can provide up to hundreds of microns of vertical compliance.

citation

Fork, D. K. ; Chua, C. L. ; Kim, P.; Romano, L. T. ; Lau, R.; Wong, L. ; Alimonda, A.; Gelaz, V. ; Teepe, M.; Haemer, J.; Modi, M. B.; Zhu, O.; Ma, D. L.; Sitaraman, S.; Smith, D. L. ; Mok, S. Nano-spring arrays for high density interconnect. SPIE Proceedings, Micromachined Devices and Components VI; 2000 September; Santa Clara, CA. Bellingham, WA: SPIE; 2000; 4176: 226-235.