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Intermittency study of a stressed-metal micro-spring sliding electrical contact

 

Electrical interconnects based on stressed-metal micro-springs are a potential alternative to conventional packaging technology such as flip-chip soldering and wire-bonding. As a high-density, compliant, pressure contact that is allowed to slide, it is important to investigate the potential for intermittent electrical glitches. Fretting experiments are performed on 80 mm pitch, gold-coated microsprings compressed to 270 mN (~0.027gram-force) against a gold pad. While the pad is cycled with a 50 mm amplitude, the contact is monitored for voltage rises greater than 100 mV and slower than 4 nsec. For 10 mA and 100 mA, no glitches have been observed for ~10000 cycles.

 
citation

Chow, E. M. ; Klein, K.; Fork, D. K. ; Hantschel, T. ; Chua, C. L. ; Wong, L. ; Van Schuylenbergh, K. Intermittency study of a stressed-metal micro-spring sliding electrical contact. Electronic Components and Technology Conference; 2003 May 27-30; New Orleans; LA; USA. Piscataway, NJ: IEEE; 2003: 1714-1717.