Applications of stress-engineered MEMS

• Bay Area MEMS Journal Club

This talk will review how PARC has been exploiting stress-engineered thin films to realize MEMS devices for a variety of applications, including: springs for integrated circuit flip-chip packaging, high quality factor 3D RF coils, tall-tip AFM imaging, and actuated cantilevers and mirrors.

citation

Chow, E. M. ; Fork, D. K. ; Hantschel, T. ; Van Schuylenbergh, K. ; Chua, C. L. ; Rosa, M. A. ; De Bruyker, D. ; Peeters, E. Applications of stress-engineered MEMS. Bay Area MEMS Journal Club; 2004 November 11; Palo Alto, CA.