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Applications of stress-engineered MEMS
- Stanford ME342 MEMS Seminar
Curved cantilever metal beams have been demonstrated to be valuable for a variety of applications, including IC packaging/testing, RF coils, afm tips, and actuators.
citation
Chow, E. M. ; Fork, D. K. ; Chua, C. L. ; Hantschel, T. ; Van Schuylenbergh, K. ; De Bruyker, D. ; Rosa, M. A. ; Peeters, E. Applications of stress-engineered MEMS. Stanford ME342 MEMS Seminar; 2005 July 13; Stanford; CA; USA.
PARC authors
related publications
Applications of stress-engineered MEMS
Wafer level packaging with soldered stress engineered micro-springs
Pressure contact micro-springs in small pitch flip-chip packages
Solder-free pressure contact micro-springs in high-density flip-chip packages
Chip on glass bonding using StressedMetal™ Technology
Wafer level packaging using StressedMetal™ technology
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