After a little introduction to PARC, I'll describe how we've been using designed stress gradients (GPa/um) to make a variety of micro-devices. The focus has been on spring based electrical interconnects for electronics packaging. We'll describe various package test vehicles we've built and tested with micrometer scale structures (smaller and more compliant than other approaches). I'll also describe a high Q RF MEMS coil and other work devices we've demonstrated based on this technology.
Chow, E. M. ; De Bruyker, D. ; Chua, C. L. ; Peeters, E. Stress-engineered MEMS. Engineering Seminar at Stanford University; 2008 October 27; Stanford, CA.