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Flip-chip bonding on 6-um pitch using thin-film microspring technology

 

Bonding-pad densities on high-performance integrated-circuit chips are beginning to exceed the limits of available interconnect technologies. Also, stresses due to thermal mismatch in flip-chipped packages are reducing time to contact failure. We have addressed both of these problems by microlithographically fabricating highly elastic cantilever springs in linear arrays on pitches down to 6-um. We have soldered test arrays of 52 springs on this pitch to Si chips with 100% contact yield and good solder wetting to every spring. The fine-pitch capability also facilitates off-chip routing; the very high compliance of the springs should avoid thermal fatigue; and low thermal conductance along the springs should allow fast-cycle soldering of chips to multi-chip modules as well as replacement chips subsequently testing faulty.

 
 
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citation

Smith, D. L. ; Fork, D. K. ; Thornton, R. L. ; Alimonda, A. S. ; Chua, C. L. ; Dunrowicz, C.; How, J. Flip-chip bonding on 6-um pitch using thin-film microspring technology. 1998 Proceedings of the 48th Electronic Components and Technology Conference; 1998 May 25-28; Seattle, WA. New York: IEEE; 1998; 325-329.

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Copyright © IEEE, 1998. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.