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Densely-packed optoelectronic interconnect using micro-machined springs

 

We demonstrate a novel optoelectronic packaging technology interconnecting 200 element independently addressable vertical-cavity surface-emitting laser arrays on 6-μm pitch to silicon driver chips with equally dense output lines. The room-temperature flip-chip process utilizes micromachined cantilevers for establishing electrical contact. Thermal cycling and thermal shock tests show excellent package reliability.

 
citation

Chua, C. L. ; Fork, D. K. ; Hantschel, T. Densely-packed optoelectronic interconnect using micro-machined springs. IEEE Photonics Technology Letters. 2002 June; 14 (6): 846-848.