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large-area electronics
Meeting a high-value, custom application need through low-cost, novel electronics
PARC scientists delivered the key components for a tape-like blast dosimeter with integrated memory, control electronics, and multiple sensors – which could be fabricated through printing techniques or be compatible with roll-to-roll processing (key for enabling the novel form factors and low cost), and be customized to specific application needs.
Enabling value-added offerings for new market
While BASF has significant chemistry expertise, it needed to integrate electronics into its materials to capture value-added opportunities with customers in the display market.
2012
Atomic layer dielectric deposition for flexible transistors
2012 Flexible Electronics & Displays Conference
9 February 2012
2011
Materials, processing, and testing of flexible image sensor arrays
IEEE Design & Test of Computers special issue on flexible electronics
December 2011
Solution-processed memristive junctions in a threshold indicator
IEEE Transactions on Electronic Devices
October 2011
Printed electronics at Palo Alto Research Center
Guest lecture for a fabrication class at Stanford
17 February 2011
2010
Reliability of all printed polymer photosensors for high illuminance detection
MRS Fall Meeting 2010
30 November 2010
Determination of recombination mechanisms in organic solar cells
IEEE 35th Photovoltaic Specialists Conference
21 June 2010
2008
Flexible and printed electronics for displays and image sensors
The Future Prospects and Obstacles of Organic Electronics
25 February 2008
1999
High resolution x-ray imaging using amorphous silicon flat panel arrays
IEEE Transactions on Nuclear Science
June 1999
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