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large-area electronics

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Meeting a high-value, custom application need through low-cost, novel electronics

PARC scientists delivered the key components for a tape-like blast dosimeter with integrated memory, control electronics, and multiple sensors – which could be fabricated through printing techniques or be compatible with roll-to-roll processing (key for enabling the novel form factors and low cost), and be customized to specific application needs.

Enabling value-added offerings for new market

While BASF has significant chemistry expertise, it needed to integrate electronics into its materials to capture value-added opportunities with customers in the display market.

2012

Atomic layer dielectric deposition for flexible transistors

2012 Flexible Electronics & Displays Conference

9 February 2012

2011

Materials, processing, and testing of flexible image sensor arrays

IEEE Design & Test of Computers special issue on flexible electronics

December 2011

Solution-processed memristive junctions in a threshold indicator

IEEE Transactions on Electronic Devices

October 2011

Printed electronics at Palo Alto Research Center

Guest lecture for a fabrication class at Stanford

17 February 2011

2010

Determination of recombination mechanisms in organic solar cells

IEEE 35th Photovoltaic Specialists Conference

21 June 2010

2008

Flexible and printed electronics for displays and image sensors

The Future Prospects and Obstacles of Organic Electronics

25 February 2008

1999

 

 

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High-Performance Structured Battery Electrodes

PARC offers a proven co-extrusion printing technique, CoEx, that can enhance both the energy and power densities of batteries. A cost-effective way to manufacture structured electrodes, this technique can be applied to both cathodes and anodes for most mature battery chemistries.