home › resources & publications › by competency - large-area electronics
large-area electronics
Atomic layer dielectric deposition for flexible transistors
2012 Flexible Electronics & Displays Conference
9 February 2012
Determination of recombination mechanisms in organic solar cells
IEEE 35th Photovoltaic Specialists Conference
21 June 2010
Enabling value-added offerings for new market
While BASF has significant chemistry expertise, it needed to integrate electronics into its materials to capture value-added opportunities with customers in the display market.
Flexible and printed electronics for displays and image sensors
The Future Prospects and Obstacles of Organic Electronics
25 February 2008
High resolution x-ray imaging using amorphous silicon flat panel arrays
IEEE Transactions on Nuclear Science
June 1999
Materials, processing, and testing of flexible image sensor arrays
IEEE Design & Test of Computers special issue on flexible electronics
December 2011
Meeting a high-value, custom application need through low-cost, novel electronics
PARC scientists delivered the key components for a tape-like blast dosimeter with integrated memory, control electronics, and multiple sensors – which could be fabricated through printing techniques or be compatible with roll-to-roll processing (key for enabling the novel form factors and low cost), and be customized to specific application needs.
Printed electronics at Palo Alto Research Center
Guest lecture for a fabrication class at Stanford
17 February 2011
Reliability of all printed polymer photosensors for high illuminance detection
MRS Fall Meeting 2010
30 November 2010
Solution-processed memristive junctions in a threshold indicator
IEEE Transactions on Electronic Devices
October 2011
search resources:
