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Enabling value-added offerings for new market

While BASF has significant chemistry expertise, it needed to integrate electronics into its materials to capture value-added opportunities with customers in the display market.

Meeting a high-value, custom application need through low-cost, novel electronics

PARC scientists delivered the key components for a tape-like blast dosimeter with integrated memory, control electronics, and multiple sensors – which could be fabricated through printing techniques or be compatible with roll-to-roll processing (key for enabling the novel form factors and low cost), and be customized to specific application needs.

Microspring characterization and flip chip assembly reliability

IEEE Transactions on Components and Packaging Technologies

February 2013