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microelectronics

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case studies

Meeting a high-value, custom application need through low-cost, novel electronics

PARC scientists delivered the key components for a tape-like blast dosimeter with integrated memory, control electronics, and multiple sensors – which could be fabricated through printing techniques or be compatible with roll-to-roll processing (key for enabling the novel form factors and low cost), and be customized to specific application needs.

Enabling value-added offerings for new market

While BASF has significant chemistry expertise, it needed to integrate electronics into its materials to capture value-added opportunities with customers in the display market.

technical publications

Microspring characterization and flip chip assembly reliability

IEEE Transactions on Components and Packaging Technologies

February 2013