PARC, a Xerox company

PARC has invented and developed the ClawConnect™ compliant, high-density, interconnect (HDI) platform technology. This technology enables ultra-thin, ultra-small, high-performance solutions -- with low total cost of ownership and without sacrificing quality and reliability.

Compact and fast read-out for wavelength-encoded biosensors

SPIE Proceedings

25 January 2010

Compact model for forward subthreshold characteristics in polymer semiconductor transistors

Journal of Applied Physics

15 October 2009

Compact model for sub-threshold operation in polymer semiconductor thin film transistors

EMC 2009

24 June 2009

Comparison of static and dynamic printed organic shift registers

IEEE Electron Device Letters

February 2013

Connecting electrical and molecular properties of semiconducting polymers for thin film transistors

MRS Bulletin

1 January 2008

Controlling the performance of semiconducting polymers for printed electronics (Invited paper)

2007 MRS Spring Meeting

9 April 2007

Correlating the microstructure of thin films of Poly[5,5’-bis(3-dodecyl-2-thienyl)-2,2’-bithiophene] with charge transport: effect of dielectric surface energy and thermal annealing.

Physical Review B

1 January 2008

Creating the future of printed electronics

Flextech (FLEX2013)

29 January 2013

Curved electronic pixel arrays using a cut and bend approach

Journal of Applied Physics

15 May 2009

Defect identification in large area electronic backplanes

IEEE Journal of Display Technology

January 2009

Degradation mechanisms of organic ferroelectric field-effect transistors used as non-volatile memory

Journal of Applied Physics

5 November 2009

Density of electronic states model for organic solar cells

2011 MRS Spring Meeting

27 April 2011

Design of printed transistor circuits for printed sensors

FlexTech (2013FLEX)

29 January 2013

Dielectrics for all-additive jet-printed organic electronics (Invited paper)

2007 MRS Spring Meeting

9 April 2007

Disordered nanowire based photovoltaics

2011 MRS Spring Meeting

28 April 2011

Electric-field-induced gap states in pentacene

Advanced Materials

26 June 2009

Electrical stability of inkjet-patterned organic complementary inverters measured in ambient conditions

Applied Physics Letters

8 June 2009

Enabling value-added offerings for new market

While BASF has significant chemistry expertise, it needed to integrate electronics into its materials to capture value-added opportunities with customers in the display market.

Experimental test for geminate recombination applied to organic solar cells

Physical Review B

September 2010

Fabrication of high aspect-ratio polymer microstructures for large-area electronic portal x-ray imagers

Sensors and Actuators A

10 November 2007

Fast polymer semiconductor transistor by nano-particle self-assembly

Organic Electronics

December 2010

Fine-feature patterning of self-aligned polymeric thin-film transistors fabricated by digital lithography and electroplating

Applied Physics Letters

2 October 2006

FLEXI Innovation Award 2012

8 February 2012

Flexible a-Si:H-based image sensors fabricated by digital lithography

MRS Spring Meeting 2007

9 April 2007

Flexible and printed electronic sensing systems

Design West: Sensors in Design

29 March 2012

Flexible and printed electronics for displays and image sensors

The Future Prospects and Obstacles of Organic Electronics

25 February 2008

Flexible and printed electronics for displays and image sensors

The Future Prospect and Obstacles of Organic Electronics

25 February 2008

Flexible and printed electronics for sensors, displays and photovoltaics

International Workshop on Flexible and Printed Electronics

8 September 2010

Flexible Electronics

1 December 2011

PARC services for novel electronics.

Flexible electronics and the value of inkjet-printing for displays and sensors

International Workshop on Flexible and Printed Electronics (IWFPE 09)

18 November 2009

Flexible electronics: materials and applications

vol. 11 of the book series: Electronic Materials: Science & Technology

2009

Flexible electrophoretic displays with jet-printed active-matrix backplanes

2005 SID International Symposium

25 May 2005

Flexible image sensor array with bulk heterojunction organic photodiodes

Applied Physics Letters

2008 May 26

Flexible large-area electronics made by additive printing

US Frontiers of Engineering Symposium

13 September 2012

Flexible micro-spring interconnects for high performance probing

Proceedings of the 50th Electronic Components and Technology Conference (ECTC)

1 May 2000

Flexible printed electronics: from materials characterization to device integration

IGERT Guest Lecture at UC Santa Barbara

7 October 2011

Flexible printed sensor tape based on solution processed materials

23rd Annual Meeting of the IEEE Photonics Society

7 November 2010

Flexible printed sensor tape for diagnostics of mild traumatic brain injury

IDTechEx Printed Electronics Asia

30 September 2009

Flexible radiation detectors

FlexTech 2012; Flexible Electronics and Displays Conference

9 February 2012

Flexible x-ray detector array fabricated with oxide thin film transistors

IEEE Electron Device Letters

May 2012

Flexible, large-area sensor circuits fabricated by additive printing

2012 NanoTechnology for Defense Conference

8 August 2012

Flexible, polymer-based light sensor arrays on active-matrix backplanes fabricated by digital inkjet printing

MRS Spring Meeting 2007

9 April 2007

From lab-scale ink-jet to mass-printed circuits

2013 Flextech Flexible Electronics and Displays Conference

29 January 2013

High current properties of a microspring contact for flip chip packaging

Hilton Head 2010

6 June 2010

High gain amplifiers with amorphous silicon thin film transistors

IEEE Electron Device Letters

August 2008

High resolution x-ray imaging using amorphous silicon flat panel arrays

IEEE Transactions on Nuclear Science

June 1999

High voltage active matrix backplane for driving array of MEMS devices based on offset-gate poly-Si high voltage TFT

MRS Spring Meeting 2008

26 March 2008

High work function materials for source/drain contacts in printed polymer thin film transistors

Applied Physics Letters

11 February 2008

Highly flexible printed alkaline batteries based on mesh embedded electrodes

Advanced Materials

2 August 2011

Highly sensitive tactile sensors integrated with organic transistors

Applied Physics Letters

2013

Hybrid Si nanowire/amorphous silicon FETs for large-area image sensor arrays

Nano Letters

2011

Ink and substrate interactions in printed field-effect transistors

Printing Electronics - Ink and Substrate Interactions

2 August 2012

Ink jet printing devices and circuits

MRS 2009 Fall Meeting

2009 November

For several years there have been many efforts to employ ink jet technologies in the fabrication of consumer electronics. The potential of displacing large and expensive pieces of electronic fabrication equipment and processes with seemingly appropriately scaled inexpensive alternatives is attractive. However, of course, the devil is in the details. Feature size, accuracy, registration, and materials all have several impacts on design rules, processing, performance, and the types of devices appropriate to the technology. Here we present a look at some of the materials and deposition challenges along with solutions developed at PARC.

Inkjet printed organic circuits for addressing non-volatile memory

2012 Spring Meeting of the Materials Research Society

10 April 2012

Inkjet-patterned titanium oxide memristive junctions connected in series for a threshold indicator

2011 MRS Spring Meeting

25 April 2011

Inkjet-patterned, organic complementary circuits and non-volatile memory arrays based on ferroelectric field-effect transistors

ECS Symposium on Thin Film Transistors

12 October 2010

Inkjet-patterned, organic complementary circuits integrated with polymer mechanical sensors

Invited paper in ECS Transactions

2010

Inkjet-printed non-volatile memory arrays using ferroelectric and resistive elements

CMOS Emerging Technologies Meeting

17 June 2011

Inkjet-printed, organic complementary circuits integrated with polymer mechanical sensors

ACS Meeting 2010

25 March 2010

Interface state recombination in organic solar cells

Physical Review B

May 2010

The interplay of materials in printed electronics

MRS Fall 2008 Meeting

1 December 2008

An investigation of signal performance enhancements achieved through innovative pixel design across several generations of indirect detection, active matrix, flat-panel arrays

Medical Physics

July 2009

Jet printing flexible displays

Materials Today

April 2006

Jet-printed active-matrix backplanes and electrophoretic displays

Japanese Journal of Applied Physics Part 1

March 2007

Jet-printed and dielectrophoretically aligned nanowires for large area electronics

Electronic Materials Conference 2010

25 June 2010

Jet-printed Si nanowires for flexible backplane applications

Nanotech Conference Technical Proceedings

23 June 2010

Jet-printing: from drops to electronic devices

Printed Electronics USA 2009

2 December 2009

Large area a-Si/Si nanowire hybrid solar cells

Nanotech Conference and Expo 2011

13 June 2011

Large modulation of carrier transport by grain-boundary molecular packing and microstructure in organic thin films

Nature Materials

8 November 2009

Louver screens as multi-functional information displays

SID Symposium 2009

June 2009

Low temperature amorphous silicon p-i-n photodiodes

Physica Status Solidi B

August 2009

Mass produced printed temperature sensors

FlexTech Alliance 2012 Flexible Electronics and Displays Conference

8 February 2012

Mass production of flexible printed temperature sensors

Spring 2012 Materials Research Society Meeting

9 April 2012

Materials and device integration for printed large area applications

2011 MRS Spring Meeting

25 April 2011

Materials and novel patterning methods for flexible electronics

Chapter in Flexible Electronics: Materials and Applications

2009

Materials, processing, and testing of flexible image sensor arrays

IEEE Design & Test of Computers special issue on flexible electronics

December 2011

Meeting a high-value, custom application need through low-cost, novel electronics

PARC scientists delivered the key components for a tape-like blast dosimeter with integrated memory, control electronics, and multiple sensors – which could be fabricated through printing techniques or be compatible with roll-to-roll processing (key for enabling the novel form factors and low cost), and be customized to specific application needs.

MEMS-based enthalpy arrays

Transducers '07

10 June 2007

Microfluidic-based detection platform for on-the-flow analyte characterization

Invited seminar talk at the University of California, Santa Cruz

5 June 2008

Microspring characterization and flip chip assembly reliability

Best Paper Award at IMAPS 2009

1 November 2009

Novel packaging with rematable spring interconnect chips for MCM

ECTC 2009

26 May 2009