Printed and Flexible Electronics
PARC has invented and developed the ClawConnect™ compliant, high-density, interconnect (HDI) platform technology. This technology enables ultra-thin, ultra-small, high-performance solutions -- with low total cost of ownership and without sacrificing quality and reliability.
While BASF has significant chemistry expertise, it needed to integrate electronics into its materials to capture value-added opportunities with customers in the display market.
PARC services for novel electronics.
For several years there have been many efforts to employ ink jet technologies in the fabrication of consumer electronics. The potential of displacing large and expensive pieces of electronic fabrication equipment and processes with seemingly appropriately scaled inexpensive alternatives is attractive. However, of course, the devil is in the details. Feature size, accuracy, registration, and materials all have several impacts on design rules, processing, performance, and the types of devices appropriate to the technology. Here we present a look at some of the materials and deposition challenges along with solutions developed at PARC.
Harnessing the combined power of SAP HANA and PARC’s HiperGraph graph analytics technology for real-time insights