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Printed and Flexible Electronics

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2010

2009

Materials and novel patterning methods for flexible electronics

Chapter in Flexible Electronics: Materials and Applications

2009

Printed electronics – prospects and challenges for displays and sensing devices

Meeting of the Bay Area Chapter of SID

15 December 2009

Jet-printing: from drops to electronic devices

Printed Electronics USA 2009

2 December 2009

Flexible electronics and the value of inkjet-printing for displays and sensors

International Workshop on Flexible and Printed Electronics (IWFPE 09)

18 November 2009

Ink jet printing devices and circuits

MRS 2009 Fall Meeting

2009 November

For several years there have been many efforts to employ ink jet technologies in the fabrication of consumer electronics. The potential of displacing large and expensive pieces of electronic fabrication equipment and processes with seemingly appropriately scaled inexpensive alternatives is attractive. However, of course, the devil is in the details. Feature size, accuracy, registration, and materials all have several impacts on design rules, processing, performance, and the types of devices appropriate to the technology. Here we present a look at some of the materials and deposition challenges along with solutions developed at PARC.

Microspring characterization and flip chip assembly reliability

Best Paper Award at IMAPS 2009

1 November 2009

Amorphous silicon thin film transistor image sensors

Philosophical Magazine

October 2009

Flexible printed sensor tape for diagnostics of mild traumatic brain injury

IDTechEx Printed Electronics Asia

30 September 2009

The prospects of inkjet printing for displays and sensor tapes

IS&T Digital Fabrication Conference 2009 (DF 09)

20 September 2009

Low temperature amorphous silicon p-i-n photodiodes

Physica Status Solidi B

August 2009

Electric-field-induced gap states in pentacene

Advanced Materials

26 June 2009

Flexible electronics: materials and applications

vol. 11 of the book series: Electronic Materials: Science & Technology

2009

Wafer level packaging with soldered stress engineered micro-springs

IEEE Transactions on Advanced Packaging

May 2009

Defect identification in large area electronic backplanes

IEEE Journal of Display Technology

January 2009

Self-stabilization in amorphous silicon circuits

IEEE Electron Device Letters

January 2009

2008

The interplay of materials in printed electronics

MRS Fall 2008 Meeting

1 December 2008

Characterization of flexible image sensor arrays with bulk heterojunction organic photodiodes

SPIE Conference on Organic Field-Effect Transistors VII and Organic Semiconductors in Sensors and Bioelectronics

10 August 2008

Microfluidic-based detection platform for on-the-flow analyte characterization

Invited seminar talk at the University of California, Santa Cruz

5 June 2008

Flexible and printed electronics for displays and image sensors

The Future Prospect and Obstacles of Organic Electronics

25 February 2008

Flexible and printed electronics for displays and image sensors

The Future Prospects and Obstacles of Organic Electronics

25 February 2008

Stress-engineered MEMS

Seminar at Stanford

1 January 2008

2007

MEMS-based enthalpy arrays

Transducers '07

10 June 2007

Jet-printed active-matrix backplanes and electrophoretic displays

Japanese Journal of Applied Physics Part 1

March 2007

2006

Pressure contact micro-springs in small pitch flip-chip packages

IEEE Transactions on Components and Packaging Technologies

December 2006

Toolset for printed electronics

International Conference on Digital Fabrication Technologies (DF 2006)

17 September 2006

Jet printing flexible displays

Materials Today

April 2006

Printed polymer-based TFTs for flexible display backplanes

USDC Flexible Display & Microelectronics Conference

7 February 2006

Vertically segregated polymer blends: their use in organic electronics

Journal of Macromolecular Science C: Polymer Reviews

January - March 2006

2005

Printed organic electronics

Chapter in Flexible Flat Panel Displays

2005

Technology Advances in Delivering Cost-Competitive Solar Energy

1 February 2005

This paper describes a particular high-performance CPV solution which compared to average flat-plate PV, uses 1/500th as much PV material and produces nearly twice as much electricity for a given collection area. The proposed solution is also smaller, cheaper, and easier to manufacture. These improvements enable generating electricity at less than half the cost possible with existing flat-plate technologies, potentially opening large new markets for clean solar energy.

2004

All jet-printed polymer thin-film transistor active-matrix backplanes

Third Annual Printable Electronics and Displays Conference and Exhibition

9 November 2004

PZT material properties at UHF and microwave frequencies derived from FBAR measurements

IEEE International Ultrasonics, Ferroelectrics, and Frequency Control 50th Anniversary Joint Conference

24 August 2004

Printed a-Si:H transistors for large area electronics

physica status solidi (c)

March 2004

2003

2000

Flexible micro-spring interconnects for high performance probing

Proceedings of the 50th Electronic Components and Technology Conference (ECTC)

1 May 2000

1999

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