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prevprinted and flexible electronics
Ink jet printing devices and circuits
MRS 2009 Fall Meeting
2009 November
For several years there have been many efforts to employ ink jet technologies in the fabrication of consumer electronics. The potential of displacing large and expensive pieces of electronic fabrication equipment and processes with seemingly appropriately scaled inexpensive alternatives is attractive. However, of course, the devil is in the details. Feature size, accuracy, registration, and materials all have several impacts on design rules, processing, performance, and the types of devices appropriate to the technology. Here we present a look at some of the materials and deposition challenges along with solutions developed at PARC.
Ink jet printing devices and circuits
MRS 2009 Fall Meeting
2009 November
For several years there have been many efforts to employ ink jet technologies in the fabrication of consumer electronics. The potential of displacing large and expensive pieces of electronic fabrication equipment and processes with seemingly appropriately scaled inexpensive alternatives is attractive. However, of course, the devil is in the details. Feature size, accuracy, registration, and materials all have several impacts on design rules, processing, performance, and the types of devices appropriate to the technology. Here we present a look at some of the materials and deposition challenges along with solutions developed at PARC.
Inkjet-printed, organic complementary circuits integrated with polymer mechanical sensors
ACS Meeting 2010
25 March 2010
Jet-printed active-matrix backplanes and electrophoretic displays
Japanese Journal of Applied Physics Part 1
March 2007
Jet-printed active-matrix backplanes and electrophoretic displays
Japanese Journal of Applied Physics Part 1
March 2007
Nature Materials
8 November 2009
Microfluidic-based detection platform for on-the-flow analyte characterization
Invited seminar talk at the University of California, Santa Cruz
5 June 2008
Microspring characterization and flip chip assembly reliability
Best Paper Award at IMAPS 2009
1 November 2009
Polymer thin-film transistor arrays for display backplanes patterned by stamping
MRS Fall Meeting 2003
1 December 2003
Pressure contact micro-springs in small pitch flip-chip packages
IEEE Transactions on Components and Packaging Technologies
December 2006
Printed polymer-based TFTs for flexible display backplanes
USDC Flexible Display & Microelectronics Conference
7 February 2006
The prospects of inkjet printing for displays and sensor tapes
IS&T Digital Fabrication Conference 2009 (DF 09)
20 September 2009
PZT material properties at UHF and microwave frequencies derived from FBAR measurements
IEEE International Ultrasonics, Ferroelectrics, and Frequency Control 50th Anniversary Joint Conference
24 August 2004
Status and opportunities for high efficiency OLED displays on flexible substrates
MRS Spring Meeting 2005
29 March 2005
Surface induced self-encapsulation of polymer thin film transistors
Advanced Materials
November 2006
Theoretical and experimental investigations of a poly-alkylated-thieno[3,2-b]thiophene semiconductor
Journal of Applied Physics
15 October 2008
Thermal cure effects on electrical performance of nanoparticle silver inks
Acta Materialia
October 2007
Timing randomly spaced events using the threshold-voltage shift in disordered semiconductors
IEEE Transactions on Electron Devices
December 2008
Toolset for printed electronics
International Conference on Digital Fabrication Technologies (DF 2006)
17 September 2006
Toolset for printed electronics
International Conference on Digital Fabrication Technologies (DF 2006)
17 September 2006
Journal of Biomolecular Screening
1 March 2004
Vertically segregated polymer blends: their use in organic electronics
Journal of Macromolecular Science C: Polymer Reviews
January - March 2006
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