MEMS, Microfluidics, & Piezo Materials
Enabling fabrication of 3D micro-devices on large and/or sensitive substrates

PARC researchers have developed a suite of non-traditional Micro-Electro-Mechanical Systems (MEMS) technologies that allow fabrication of 3D micro-devices on:
-	large substrates (larger than a silicon wafer); and/or
-	sensitive substrates (plastic foils, printed circuit board, completed semiconductor circuitry).

Metal films and plastics are the materials of choice, and only low temperatures (<120 C) are necessary for fabricating PARC-designed MEMS.

Research Areas

• StressedMetal™ MEMS process — PARC researchers developed this remarkably versatile method for producing 3D micro-structures using stress-engineered metal films. Demonstrated applications include:
  • ClawConnect™ electrical and mechanical interconnects that are used for LCD interconnects, thin stacked chip packages, wafer level packaging, high frequency connectors, and probe cards;
  • High Q-factor integrated on-chip inductors for cell phone and other wireless applications;
  • Large stroke (up to 100 µm) electrostatic actuators (binary or analog);
  • Laser beam steering or scanning mirrors
  • and more.
     
• Microfluidic Devices — PARC has built over 25 years expertise in multiple drop-ejection technologies (piezo, thermal, acoustic) and dry aerosol (powder + gas) dosing (ballistic aerosol marking). Typical materials include microfabricated metals and plastics. Our microfluidics work has also been extended from drop ejectors to include micro-channeled continuous flow devices – such as particle separation devices for water filtration.
   
• Piezoelectrics — PARC has extensive know-how on a broad range of thin-film piezoelectric materials and a variety of techniques for depositing them onto substrates.