StressedMetal™ MEMS Solutions

The StressedMetal™ MEMS process is a proprietary PARC technology for building three-dimensional MEMS (micro-electro-mechanical systems) devices. It is one of several MEMS technologies under development at PARC.

PARC has developed a diverse range of applications using this core StressedMetal™ technology, including: ClawConnect™ Spring Array Solutions, High-Q Integrated Inductor Coil Solutions, and AFM (atomic force microscope) Probe Tip Solutions.

StressedMetal™ ClawConnect™Spring Array Solutions
StressedMetal™ High-Q Integrated Inductor Coil Solutions	StressedMetal™ AFM Probe Tip Solutions

PARC's StressedMetal™ fabrication methodology improves upon traditional, elaborate deposition processes that build structures layer upon layer. StressedMetal™ MEMS offer a simpler approach—using fewer process steps and standard thin-film equipment—that enables broad new product features such as lower cost, higher quality, and finer pitch.

StressedMetal™ Applications

• ClawConnect™ Spring Array Solutions:
  • LCD Driver Interconnects— fine-pitch COG (chip-on-glass) bonding
  • Wafer-Level Packaging (WLP), Burn-in, & Test— compliant, fine pitch
  • Solder-Free Springs— reliable, solder-free contacts
  • Stacked Packages— thin, re-workable modules for various IC stacks
  • High-Frequency Backplane Interconnects— improved signal integrity
  • Probe Cards— low-cost probing
  • Interconnects for VCSELs— world’s most densely packed laser array
     
• High-Q Integrated Inductor Coil Solutions: on-chip, out-of-plane inductors
   
• AFM Probe Tip Solutions: imaging deep trench, aqueous, & other substrates