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StressedMetal™ Fabrication and Assembly

How It Works

PARC’s StressedMetal core technology takes advantage of the stress that occurs in the thin-film deposition process. To create StressedMetal structures, extremely thin layers of metal films are sputter-deposited onto a substrate such as glass or silicon with an engineered, built-in stress gradient. PARC has developed techniques to precisely control these imposed stress gradients within the layers of deposited metal.

After patterns are lithographically etched into the thin-film layers, the metal structures are released from the substrate. The metal’s inherent stress and subsequent release cause it to lift or curl into a designed radius of curvature, forming three-dimensional springs, or “claws."

ClawConnect™ Spring Fabrication Steps
ClawConnect™ Spring Array Solutions

 

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StressedMetal™ Inductor Coil Self-Assembly
High-Q Integrated Inductor Coil Solutions

Click to see the self-assembly process. PARC's out-of-plane solenoids are made using patented stress-engineered films.

 
StressedMetal™ Applications

Return to StressedMetal™ MEMS Solutions

BUSINESS CONTACT
Nitin Parekh
Director of Business Development, Hardware Systems & Electronic Materials and Devices Laboratories
650-812-4132
RELATED WEBPAGES

StressedMetal™ MEMS Solutions

ClawConnect™ Spring Array Solutions

High-Q Integrated Inductor Coil Solutions

AFM Probe Tip Solutions

NEWS AND PUBLICATIONS

Wafer Level Packaging Using StressedMetal® Technology, IMAPS Proceedings

Chip on Glass Bonding Using StressedMetal™ Technology, SID Digest

Nano-spring Arrays for High Density Interconnect, SPIE Proceedings

Stressed Metal Nanosprings, Advanced Packaging Magazine (Cover Story)

Applications of Stress-Engineered MEMS, seminar

   

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