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Cleanroom Services

about parc

PARC Cleanroom

Cleanroom Services: Optoelectronics & Thin-Film Electronics

A key PARC asset is our unique set of Cleanroom facilities which allow clients to develop novel prototype devices and technologies quickly and cost-effectively.

Meeting Your Technology Needs

We work closely with clients to develop new processes, build prototypes, and transition technology to manufacturing. We can work with you on a variety of design and process-driven projects.

Optoelectronics Cleanroom and Resource Services

We have fully developed processes to design and fabricate a wide variety of active optoelectronic devices.  Our facilities support sponsored R&D and product development for clients to prototype novel optical sources and systems that are transferable to manufacturers.

Get Info - Optoelectronics Cleanroom

Custom Optoelectronics and III-V Semiconductor Processing Services:

  • Device/system design
  • Device process development
  • Proof-of-concept development
  • Prototype demonstration
  • Full system integration
  • Technology transfer

Device Expertise:

  • AlGalnN semiconductor materials
  • Novel heterostructures
  • Blue and UV LEDs
  • Blue-violet laser diodes
  • High-power UV-A laser diodes
  • Deep-UV lasers
  • Semiconductor optical amplifiers
  • Photodetectors
  • Novel growth strategies
  • Novel templates for epitaxy

Thin-Film and Novel Electronics Cleanroom Services

Our clients benefit from our expertise in working with semiconductor thin-film materials including amorphous silicon, metal oxides, low temperature poly-silicon and MEMS.  We have fully developed processes to design and fabricate a wide variety of active devices.

Our Cleanroom is one of the only facilities in the world that can work with clients to prototype display and imager thin-film transistor (TFT) backplanes, which are compatible with manufacturing facilities.

Get Info - Thin Film Cleanroom

Established Processes:

  • Thin-film transistor backplanes and displays
  • Thin-film transistor logic
  • Amorphous silicon photodiodes and image sensors
  • Flexible X-ray sensors
  • Stressed metal processing
  • High density flip chip interconnect
  • Stress engineered thin films
  • Micro spring fabrication and testing
  • Micro assembly
  • Micro assembler printer
  • Micro jet drug delivery
  • Processing on flexible substrates including thin polyimide

Unique Capabilities:

  • Sputtering (PVD)
  • ALD
  • ITO deposition
  • Parylene coating
  • Laser recrystallization
  • Photolithographic patterning
  • Wet and dry etching
  • Deep RIE
  • CAIBE (dry etching technique)
  • Wafer bonding
  • Electroplating
  • Hydrogenation
  • SEM, AFM, High-resolution X-ray diffraction

Additional information

Focus Areas

Our work is centered around a series of Focus Areas that we believe are the future of science and technology.

Commercialization Opportunities

We’re continually developing new technologies, many of which are available for Commercialization.


PARC scientists and staffers are active members and contributors to the science and technology communities.


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