Printed and Hybrid Electronics
Printed and hybrid electronics enable flexible, large area circuits on plastic and paper substrates for applications like smart packaging, wearables and structural electronics in automotive and aerospace solutions. PARC scientists work with commercial and government clients to invent and develop novel devices and systems, comprising of smart inks and ultrathin microchips.
Our expertise in materials characterization and device and circuit design help to deliver industrial-quality electronic prototypes that demonstrate exceptional functionality and manufacturability. We explore radically new manufacturing concepts, merging the micro and macro to create electronics in innovative form factors; and can build layered novel electronics architectures as an extension of additive manufacturing. We also maintain partnerships with material makers, alongside printing, electronics and consumer product firms, to create this next generation of electronics.
Examples of our work include:
- Flexible electronics development for lightweight, rugged, bendable, rollable and foldable devices
- Thin-film transistors and p-i-n photodiodes for flat panel display and image sensor backplanes
- Multimaterial printing processes combining inkjet, aerosol jet and extrusion printing for organic semiconductors, conductors, sensors, microchips and structural materials
- Customizing, building and integrating sensing electronics into any form factor
- Design and fabrication of hardened prototypes and proof-of-concept level demonstrators of materials, fabrication tools and product ideas
- Hybrid electronics prototyping using smart inks and microchips for smart packaging, automotive or wearables
Download our Printed and Hybrid Electronics Information Sheet to learn more.
Our work is centered around a series of Focus Areas that we believe are the future of science and technology.
We’re continually developing new technologies, many of which are available for Commercialization.