Additive Manufacturing for Electronics Beyond Moore

Details

San Francisco, CA USA. Date of Talk: 12/05/2016

Speakers

Janos Veres
Event

Additive Manufacturing for Electronics Beyond Moore

Additive manufacturing and 3D printing is poised to reshape entire manufacturing value chains. To be truly disruptive, additive manufacturing has to move beyond shapes and colors. Novel printing technologies are beginning to emerge that enable conformal electronics and even print with inks containing microchips. This in turn also creates new openings for the progress of electronics itself. Over the last 50 years silicon microelectronics advanced through shrinking device dimensions and packing more and more functionality into tiny volumes. Printing opens up new ways of scaling electronics Beyond Moore. New form factors, complex shapes, conformal devices and distributed systems become possible. Printed, hybrid electronics systems are of significant interest for sensor systems, structural electronics and wearable devices.

Additional information

Focus Areas

Our work is centered around a series of Focus Areas that we believe are the future of science and technology.

FIND OUT MORE
Licensing & Commercialization Opportunities

We’re continually developing new technologies, many of which are available for Commercialization.

FIND OUT MORE
News

PARC scientists and staffers are active members and contributors to the science and technology communities.

FIND OUT MORE