Chemical Mechanical Planarization (CMP) for MEMS Fabrication: An Article Review and Open Discussion

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Event

George E. Pake Auditorium 2006-06-08

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Event

Chemical Mechanical Planarization (CMP) for MEMS Fabrication: An Article Review and Open Discussion

CMP can minimize topographic effects, enabling the stacking of multilayer metal interconnects and the damascene approach in semiconductor manufacturing. While CMP is used in the production of some mainstream MEMS products, it has not found widespread application across the MEMS field. We will briefly review the published literature to highlight the CMP method, explore the reasons for 'MEMS-CMP phobia', and review some processes that are fine tuned for MEMS fabrication. This brief review will be followed by an open discussion regarding the capabilities and limitations of CMP to enhance MEMS fabrication.

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