Chiplet Micro-Assembly Printer

Details

Las Vegas, NV USA. Date of Talk: 2019-05-31
Event

Chiplet Micro-Assembly Printer

A deterministic, directed, parallel electrostatic assembly and transfer process is being developed to arrange chips for electronics applications. Singulated chips 10 um 200 um in size and initially in solution, are sorted, transported and oriented to form programmed patterns. The arrangements are then transferred to a final substrate with contact stamping or an electrostatic roller belt. Demonstrations achieved include automated parallel assembly, micrometer scale registration, heterogeneous integration, inch scale outputs, and basic functional circuits. The eventual goal is the ability to integrate millions of chiplets into systems with fine control over large areas to enable next generation electronic systems.

Additional information

Focus Areas

Our work is centered around a series of Focus Areas that we believe are the future of science and technology.

FIND OUT MORE
Commercialization Opportunities

We’re continually developing new technologies, many of which are available for Commercialization.

FIND OUT MORE
News

PARC scientists and staffers are active members and contributors to the science and technology communities.

FIND OUT MORE