Compliant High-Density Interconnect for Semiconductors and Optoelectronics

Details

San Jose, CA USA. Date of Talk: 9/16/2015
Event

Compliant High-Density Interconnect for Semiconductors and Optoelectronics

PARCs research into microsprings for IC packaging and probing will be summarized. The springs are made with deposited metal thin films and are lithographically defined, capable of fine pitch (6m demonstrated) and low profiles (<5m). They have been used in commercial probe cards. PARC has focused on research for flip-chip packaging applications. The springs can be used for metal pad pressure contacts, enabling at-speed test of die in multi-chip modules before bonding. Such a capability could preclude the need for known good die and dramatically reduce the cost to produce multi-chip packages and modules. PARCs other research related to electronic devices and packaging will also be briefly introduced, including micro-assembly, micro-coils, and 3D printing.

Additional information

Focus Areas

Our work is centered around a series of Focus Areas that we believe are the future of science and technology.

FIND OUT MORE
Licensing & Commercialization Opportunities

We’re continually developing new technologies, many of which are available for¬†Commercialization.

FIND OUT MORE
News

PARC scientists and staffers are active members and contributors to the science and technology communities.

FIND OUT MORE