Micro Assembly Printer for LED and Beyond
Details
Event
LEDforum2019
July 2, 2019, Taipei, Taiwan
Speakers
Event
Micro Assembly Printer for LED and Beyond
PARC is developing a deterministic, directed, parallel electrostatic assembly and transfer process to arrange microLEDs and other IC chiplets. Singulated chips 10 um – 200 um in size are sorted, transported and oriented in solution. The arrangements are then transferred to a final substrate with contact stamping or an electrostatic roller belt.
Demonstrations achieved include automated parallel assembly, micrometer scale registration, heterogeneous integration, inch scale outputs, and basic functional circuits. The eventual goal is the ability to integrate millions of chiplets into systems with fine control over large areas, at the cost of printing, to enable next generation microLED displays and heterogeneous electronic systems.
Additional information
Focus Areas
Our work is centered around a series of Focus Areas that we believe are the future of science and technology.
Licensing & Commercialization Opportunities
We’re continually developing new technologies, many of which are available for Commercialization.
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