Micro Assembly Printer for LED and Beyond

PARC is developing a deterministic, directed, parallel electrostatic assembly and transfer process to arrange microLEDs and other IC chiplets. Singulated chips 10 um – 200 um in size are sorted, transported and oriented in solution. The arrangements are then transferred to a final substrate with contact stamping or an electrostatic roller belt. Demonstrations achieved include automated parallel assembly, micrometer scale registration, heterogeneous integration, inch scale outputs, and basic functional circuits. The eventual goal is the ability to integrate millions of chiplets into systems with fine control over large areas, at the cost of printing, to enable next generation microLED displays and heterogeneous electronic systems.