George E. Pake Auditorium 2004-11-11
This talk will review how PARC has been exploiting stress-engineered thin films to realize MEMS devices for a variety of applications, including: springs for integrated circuit flip-chip packaging, high quality factor 3D RF coils, tall-tip AFM imaging, and actuated cantilevers and mirrors.
Our work is centered around a series of Focus Areas that we believe are the future of science and technology.
Licensing & Commercialization Opportunities
We’re continually developing new technologies, many of which are available for Commercialization.
PARC scientists and staffers are active members and contributors to the science and technology communities.