Stress-Engineered MEMS

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Event

George E. Pake Auditorium 2004-11-11

Speakers

Event

Stress-Engineered MEMS

This talk will review how PARC has been exploiting stress-engineered thin films to realize MEMS devices for a variety of applications, including: springs for integrated circuit flip-chip packaging, high quality factor 3D RF coils, tall-tip AFM imaging, and actuated cantilevers and mirrors.

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