Transient electronics based on frangible stress-engineered glass substrates

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Event GOMACTech-17
Reno, NV USA. Date of Talk: 03/22/2017

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Transient electronics based on frangible stress-engineered glass substrates

We present an approach to transient electronics based on fracturing electronic components into small pieces and widely dispersing the fragments over large areas. We utilized engineered glass substrates that is strong and stable, but rapidly disintegrates into small fragments when triggered. As stored strain energy is released, electronic components disposed on the glass substrate is fractured together with the glass.

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