Transient electronics based on frangible stress-engineered glass substrates
Details
Event
GOMACTech-17
Reno, NV USA. Date of Talk: 03/22/2017
Speakers
Limb, Scott
Garner, Sean
Gregory L Whiting
Event
Transient electronics based on frangible stress-engineered glass substrates
We present an approach to transient electronics based on fracturing electronic components into small pieces and widely dispersing the fragments over large areas. We utilized engineered glass substrates that is strong and stable, but rapidly disintegrates into small fragments when triggered. As stored strain energy is released, electronic components disposed on the glass substrate is fractured together with the glass.
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