Cleanroom Services

Design, Develop and Fabricate Novel Optoelectronic and Thin-Film Devices

A key PARC asset is our unique set of Cleanroom facilities which allow clients to develop novel prototype devices and technologies quickly and cost-effectively. We work closely with clients to develop new processes, build prototypes, and transition technology to manufacturing. 

• Rapidly advance new projects from concept to production-ready
• Work with next-generation materials
• Create custom prototypes, even at low volumes
• Compete effectively in a rapidly evolving market
• Test, learn and iterate quickly and cost-effectively
• Reduce risk and control costs while focusing on your core business

Optoelectronics Cleanroom and Resource Services

We have fully developed processes to design and fabricate a wide variety of active optoelectronic devices.  Our facilities support sponsored R&D and product development for clients to prototype novel optical sources and systems that are transferable to manufacturers.

Custom Optoelectronics and III-V Semiconductor Processing Services:

• Device/system design
• Device process development
• Proof-of-concept development
• Prototype demonstration
• Full system integration
• Technology transfer

Device Expertise:

• AlGalnN semiconductor materials
• Novel heterostructures
• Blue and UV LEDs
• Blue-violet laser diodes
• High-power UV-A laser diodes
• Deep-UV lasers
• VCSEL
• VECSEL
• Semiconductor optical amplifiers
• Photodetectors
• Novel growth strategies
• Novel templates for epitaxy

Thin-Film and Novel Electronics Cleanroom Services

Our clients benefit from our expertise in working with semiconductor thin-film materials including amorphous silicon, metal oxides, low temperature poly-silicon and MEMS.  We have fully developed processes to design and fabricate a wide variety of active devices.

Our Cleanroom is one of the only facilities in the world that can work with clients to prototype display and imager thin-film transistor (TFT) backplanes, which are compatible with manufacturing facilities.

Established Processes:

• Thin-film transistor backplanes and displays
• Thin-film transistor logic
• Amorphous silicon photodiodes and image sensors
• Flexible X-ray sensors
• Stressed metal processing
• High density flip chip interconnect
• Stress engineered thin films
• Micro spring fabrication and testing
• Micro assembly
• Micro assembler printer
• Micro jet drug delivery
• Processing on flexible substrates including thin polyimide

Unique Capabilities:

• LPCVD
• PECVD
• Sputtering (PVD)
• ALD
• ITO deposition
• Parylene coating
• Laser recrystallization
• Photolithographic patterning
• Wet and dry etching
• Deep RIE
• CAIBE (dry etching technique)
• Wafer bonding
• Electroplating
• Hydrogenation
• SEM, AFM, High-resolution X-ray diffraction