Materials and novel patterning methods for flexible electronics

Details

Event Chapter in Flexible Electronics: Materials and Applications

Authors

Wong, William S.
Tse Nga Ng
Technical Publications
January 1st 2009
The materials considerations and print-processing techniques for fabricating electronic devices on flexible platforms are reviewed. Both organic and inorganic materials for the semiconductor, dielectric, and metals for thin-film transistor fabrication are presented. Jet-printing techniques for both etch-mask patterning and deposition and patterning of solution processable polymers will be highlighted. The characterization of low-temperature compatible materials will also be reviewed with discussing considerations that determine device stability and performance in polymeric and silicon-based devices. Finally, an overview of specific applications for organic and inorganic semiconductor devices in backplane, display, and image sensor arrays will be presented.

Citation

Wong, W. S.; Chabinyc, M.; Ng, T.; Salleo, A. Materials and novel patterning methods for flexible electronics. Chapter in Flexible Electronics: Materials and Applications, edited by Alberto Salleo and William S. Wong, vol. 11 of Springer series on Electronic Materials: Science & Technology. NY: Springer; 2009; 143-181.

Additional information

Focus Areas

Our work is centered around a series of Focus Areas that we believe are the future of science and technology.

FIND OUT MORE
Licensing & Commercialization Opportunities

We’re continually developing new technologies, many of which are available for Commercialization.

FIND OUT MORE
News

PARC scientists and staffers are active members and contributors to the science and technology communities.

FIND OUT MORE