Materials, processing, and testing of flexible image sensor arrays

Details

Event IEEE Design & Test of Computers special issue on flexible electronics

Authors

Wong, William S.

Tse Nga Ng

Sambandan, Sanjiv

Technical Publications

September 1st 2011

An overview of the requirements for flexible image sensor arrays is given. Sensor devices based on amorphous silicon and polymeric bulk heterostructures are analyzed and compared. A comparison of organic and inorganic sensor performance under applied stress is given, and a charge-map testing and characterization technique for flexible arrays is described. Finally, the fabrication of a flexible organic sensor array is presented.

Citation

Wong, W. S.; Ng, T.; Sambandan, S.; Chabinyc, M. Materials, processing, and testing of flexible image sensor arrays. IEEE Design & Test of Computers - special issue on flexible electronics. 2011 November-December; 28 (6): 16-23.

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