RF Energy Harvesting Peel-and-Stick Sensors

Details

Event InterPACK Packaging and Integration of Electronic and Photonic Microsystems 2017

Authors

George Daniel
Christopher Lalau-Keraly
Shakthi Gowri
Quentin Baudenon
Jose Saavedra
Technical Publications
August 29th 2017

Citation

Schwartz, D. E.; Smith, C.; Lee, J.; Daniel, G.; Lalau-Keraly, C.; Gowri, S.; Baudenon, Q.; Saavedra, J. RF Energy Harvesting Peel-and-Stick Sensors. InterPACK Packaging and Integration of Electronic and Photonic Microsystems 2017.; San Francisco, CA USA. Date of Talk: 2017-08-29

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